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Joint Venture with American Standard Circuits Inc. USA
TECHNICAL STANDARDS & PARAMETERS

PCB Manufacturing Capabilities

Precision tolerances, advanced layer configurations, and state-of-the-art production specifications for high-reliability electronics.

TOTAL SOLUTIONS PROVIDER

AS&R Circuits India Pvt. Ltd. is a Total Solutions Provider for the PCB Industry, capable of delivering advanced technology to virtually every industry sector in quantities ranging from quick prototypes to large volume production.

Founded in 1988, American Standard Circuits is a leading manufacturer of advanced circuit board solutions worldwide. Our ongoing commitment to leading-edge higher level interconnect technology, cost-effective manufacturing, and unparalleled customer service has put us at the forefront of advanced technology circuit board fabrication.

We manufacture quality rigid, metal-backed, and flex printed circuit boards on various types of substrates for a variety of applications.

RIGID BOARDS

Capacity for Rigid Board

Item Standard Advance
Layer Counts 1-12 Layers 12-56 Layers
Final Board Thickness 0.4-3.2 mm 0.2-7.0 mm
Max. Panel Size 508mm * 640mm 610mm * 1400mm
Available Laminate Material CEM-3, FR-4 (High TG, High CTI, Halogen Free, High Frequency), PET, Ceramic Base, Metal Core Flex Cyanate Ester & Polyamide, All Rogers, Duroid, Arlon, Nelco & Special Materials
Surface Finish HASL, LF-HASL, ENIG, Immersion Silver, Immersion Tin, OSP, Hard Gold
Impedance Control ± 10% ohm ± 5% ohm
Min. Line Width / Space 3 / 3 mil 3 / 2.5 mil
Max Aspect Ratio 10:1 30:1
Copper Thickness Standard: 18μm, 35μm, 70μm, 105μm 140μm (inner layer) - 280μm (outer layer)
Min. Finished Hole Size 0.2 mm 0.1 mm
FLEX & RIGID-FLEX

Capacity for FPC & Rigid-Flex PCB

Item Flex PCB Rigid-Flex PCB
Material PI, PET, PEN PI + FR4 + Special Materials
Layers 1-18 2-22
Base Copper Thickness 1/4 - 2 OZ 1/4-2 OZ for flex, 1/4-4 OZ for rigid
Board Thickness (Min) Single Sided 0.05 mm -
Double Sided 0.10 mm 0.20 mm
Board Dimension (Max) 500mm x 800mm -
Width / Space (Min) Copper weight upto 0.5 OZ 0.06 mm
Copper weight upto 0.5-1 OZ 0.075 mm
Copper weight over 1 OZ 0.10 mm
Via Type Through hole, Blind, Buried
Silkscreen Width / Space (Min) 0.10 mm
Solder Mask Bridge (Min) 0.20 mm for coverlay, 0.12 mm for LPI
Hole (Min) Drill 0.15 mm
Punching 0.5 mm
Slot (Min) 0.5 mm (punching), 0.8 mm (Routing)
Dimension Tolerance Line Width 0.03 mm (W<=0.3mm), 10%(W>0.3mm)
Hole (NPTH) +0.05 mm
Hole (PTH) +0.05 mm
Outline +0.10 mm, Special +0.05 mm with high precise hard tool
Conductor to Outline +0.10 mm, Special +0.05 mm with high precise hard tool
Surface Treatment ENIG Ni: 2-6μm(80-240u”), Au:0.05-0.10μm(2-4u”)
Ni/Au Plating Ni: 2-8μm(80-320u”), Au:0.05-2μm(2-80u”)
Tin Plating 5-20μm
Immersion Silver 0.1-0.4μm
Immersion Tin 0.5-1.5μm
OSP 0.2μm min
Hard gold Hardness over 150 HV
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